Global Silicon on Insulator Industry Market Research Report 2019

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In this report, the Global Silicon on Insulator Industry Market Research Report 2019 market is valued at USD XX million in 2017 and is expected to reach USD XX million by the end of 2025, growing at a CAGR of XX% between 2017 and 2025. Global Silicon on Insulator Industry Market Research Report 2019 market has been broken down by major regions, with complete market estimates on the basis of products/applications on a regional basis.

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This report studies the Silicon on Insulator (SOI) market. Silicon on Insulator (SOI) is a semiconductor fabrication technique developed by IBM that uses pure crystal silicon and silicon oxide for integrated circuits (ICs) and microchips. An SOI microchip processing speed is often 30% faster than today’s complementary metal-oxide semiconductor (CMOS)-based chips and power consumption is reduced 80%, which makes them ideal for mobile devices. SOI chips also reduce the soft error rate, which is data corruption caused by cosmic rays and natural radioactive background signals.

Silicon on Insulator (SOI) is a new type of starting material for the chipmaking process. SOI wafers have three layers; a thin surface layer of silicon (from a few hundred Angstrom to several microns thick) where the transistors are formed, an underlying layer of insulating material on a support or “handle” bulk silicon wafer. The insulating layer, usually made of silicon dioxide, is referred to as the “buried oxide” or “BOX”, and is usually a few thousand Angstroms thick. Transistors built within the top silicon layer, switch signals faster, run at lower voltages, and are much less vulnerable to signal noise from background cosmic ray particles. Each transistor is isolated from its neighbor by a complete layer of silicon dioxide. These transistors are immune to “latch-up” problems and can be spaced closer together than transistors built on bulk silicon wafers. Building circuits on SOI increases Fab productivity by allowing for more compact circuit designs, yielding more chips per wafer.

SOI enables increased chip functionality without the cost of major Fab process equipment changes. Faster circuit operation and lower operating voltages have produced a powerful surge in the performance of high-speed network servers and new designs for hand-held computing and communication devices with longer battery life. Advanced circuits, using multiple layers of SOI-type device silicon, can lead the way to a coupling of electrical and optical signal processing into a single chip resulting in a dramatic broadening of communication bandwidth and new applications such as global-ranging, direct-link entertainment and communication to hand-held devices.

The market in APAC is expected to grow at the highest CAGR during 2018–2023. APAC is witnessing an increase in the use of SOI products owing to the presence of a large number of consumer electronic companies, smartphone manufacturers, and wafer and foundry players in APAC.

The global Silicon on Insulator market is valued at 500 million US$ in 2018 is expected to reach 1830 million US$ by the end of 2025, growing at a CAGR of 17.6% during 2019-2025.

This report focuses on Silicon on Insulator volume and value at global level, regional level and company level. From a global perspective, this report represents overall Silicon on Insulator market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.

At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:

Soitec SA

Shin-Etsu Chemical


Segment by Regions

North America




Segment by Type

300mm SOI

Small Diameters

Segment by Application

Automobile and Smart Industry

Consumer Electronic


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