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Global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Industry Depth Survey Report 2019

In this report, the Global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Industry Depth Survey Report 2019 market is valued at USD XX million in 2017 and is expected to reach USD XX million by the end of 2025, growing at a CAGR of XX% between 2017 and 2025. Global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) Industry Depth Survey Report 2019 market has been broken down by major regions, with complete market estimates on the basis of products/applications on a regional basis.

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High Bandwidth Memory (HBM) is a high-performance RAM interface for 3D-stacked DRAM from AMD and Hynix. It is to be used in conjunction with high-performance graphics accelerators and network devices. Hybrid Memory Cube (HMC) is a high-performance RAM interface for through-silicon vias (TSV)-based stacked DRAM memory competing with the incompatible rival interface High Bandwidth Memory (HBM).

In terms of geographic regions, APAC is expected to grow at the highest CAGR during the forecast period. The major drivers for the rapid growth of the HMC and HBM market in APAC are the growing number of data centers and servers, increasing shipments of network equipment, and the rising number of manufacturing activities in the enterprise storage and consumer electronics sectors. The strong economic growth and growing demand for high-density memories is expected to drive the HMC and HBM market in the APAC region.

The global Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.

This report focuses on Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) volume and value at global level, regional level and company level. From a global perspective, this report represents overall Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM) market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.

At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.

The following manufacturers are covered:

Micron

Samsung

SK Hynix

Advanced Micro Devices

Intel

Xilinx

Fujitsu

Nvidia

IBM

Open-Silicon

Cadence

Marvell

Segment by Regions

North America

Europe

China

Japan

Segment by Type

By Memory Type

Hybrid Memory Cube (HMC)

High-bandwidth memory (HBM)

By Product Type

Graphics Processing Unit (GPU)

Central Processing Unit (CPU)

Accelerated Processing Unit (APU)

Field-programmable Gate Array (FPGA)

Application-specific Integrated Circuit (ASIC)

Segment by Application

Graphics

High-performance Computing

Networking

Data Centers

Browse full research report at https://www.crystalmarketreport.com/global-hybrid-memory-cube-hmc-and-high-bandwidth-memory-hbm-industry-depth-survey-report-2019

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